| 摘要 |
Integrated circuits are built layer by layer on a substrate. One technique for forming layers is chemical vapor deposition (CVD.). This technique injects gases through a gas-dispersion fixture into a chamber. The gases react and blanket a substrate in the chamber with a material layer. One way to promote uniform layer thickness is to coat the gas-dispersion fixture with a uniform layer of the material before using it for deposition on the substrate. However, known fixture-coating techniques yield uneven or poorly adherent coatings. Accordingly, the inventor devised new methods for coating these fixtures. One exemplary method heats a fixture to a temperature greater than its temperature during normal deposition and then passes one or more gases through the fixture to form a coating on it. The greater conditioning temperature improves evenness and adhesion of the fixture coating, which, in turn, produces higher quality layers in integrated circuits.
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