发明名称 Optical module and method of manufacturing the same, and hybrid integrated circuit, hybrid circuit board, electronic apparatus, opto-electricity mixed device, and method of manufacturing the same
摘要 To provide a technology, which enable carrying out an optical position alignment precisely and easily in apparatus and the like used in optical communication, a method of manufacturing an optical module includes forming a guide pin in either a transparent substrate or an optical transmission line support member; forming a guide hole, in which the guide pin is to be inserted, to the other one of the transparent substrate and the optical transmission line support member such that the diameter of the guide hole is made larger as compared with the diameter of the hole; arranging a jig having a protruding portion, of which diameter is substantially the same as the diameter of the guide pin, over the transparent substrate such that the protruding portion is being inserted into the guide hole; filling the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing; adjusting a position of the jig; curing the filler material, which is filled in the gap between the protruding portion and the guide pin; and pulling out the protruding portion from the guide hole.
申请公布号 US2004234210(A1) 申请公布日期 2004.11.25
申请号 US20040761210 申请日期 2004.01.22
申请人 SEIKO EPSON CORPORATION 发明人 NAGASAKA KIMIO;MIYAMAE AKIRA;KANEKO TAKEO
分类号 G02B6/122;G02B6/42;H05K1/02;(IPC1-7):G02B6/36;G02B6/12 主分类号 G02B6/122
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