发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST WITH FAVORABLE STORAGE STABILITY, AND USE METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive dry film having excellent storage stability, being developable with an aqueous solution, having high adhesion property, resulting a favorable pattern and showing little change in the solubility in an alkali with time, and to provide the use method thereof. <P>SOLUTION: The photosensitive composition contains: (A) soluble polyimide having a carboxyl group and/or a hydroxyl group; (B) a (meth)acrylic compound; (C) an epoxy compound; and (D) a latent hardening agent. The photosensitive dry film resist is produced from the composition. The use method thereof is also presented. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004333672(A) 申请公布日期 2004.11.25
申请号 JP20030127003 申请日期 2003.05.02
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 TAKIGUCHI TOMOTERU;OKADA YOSHIFUMI;NISHIKAWA KAORU;YAMANAKA TOSHIO
分类号 G03F7/027;C08G59/40;C08G73/10;G03F7/004;G03F7/32 主分类号 G03F7/027
代理机构 代理人
主权项
地址