| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board with cavities by which the bad influence by variations in thickness between layers or in thickness of a conductor can be prevented. <P>SOLUTION: The method of manufacturing the multilayer printed wiring board with cavities comprises processes of forming a cavity 2 by spot facing in a copper clad laminate 1 which constitutes a base layer in such a manner that it is extended through a resin layer 1-1 to expose a copper layer 1-2 before making the copper clad laminate into a multilayer structure, filling the cavity with a metal 3 different from copper, forming copper plating layers 4-1 and 4-2 on both faces of the copper clad laminate, forming circuit patterns 5-1 and 5-2 from the copper plating layers including the copper layer on both faces of the copper clad laminate, forming insulation layers 6-1 and 6-2 and circuit patterns 8-1 and 8-2 each forming at least a single layer on both faces of the copper clad laminate to laminate into a multilayer structure, forming a cavity 9 by spot facing from one face side of the copper clad laminate to the metal 3, and removing the metal by etching. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
