| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface acoustic wave (SAW) device with which the generation of a through hole through an inner surface and an outer surface of a dam can be surely suppressed, in the manufacturing method of the SAW device which includes a structure sealing a gap between a SAW element and a wiring board with a resin and is equipped with the frame-like dam for preventing the resin from flowing into an IDT side. <P>SOLUTION: In the manufacturing method of the SAW device 1, a SAW element 2 with which an IDT 5 and wiring electrodes 6-9 are formed on one principal surface and a frame-like dam 12 composed of a photo-sensitive resin is formed while including portions crossing the wiring electrodes 6-9, is bonded on a wiring board 3 by flip chip bonding and the gap between the SAW element 2 and the wiring board 3 is filled with a resin 14. When forming the dam 12, exposure is performed for patterning the dam 12 on a photo-sensitive resin layer and a portion, where the dam formed portion and the wiring electrodes 6-9 cross one another, is then exposed again. As a result, the generation of the hole through the inner surface and the outer surface of the dam can be effectively suppressed, so that the resin can be surely suppressed from flowing into the side where the IDT is provided. Therefore, yield of the SAW device can be effectively improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
