| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moldability and reflow resistance and suitable for sealing a VLSI and to provide an electronic part device having an element sealed with the composition. SOLUTION: The epoxy resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a curing accelerator. Furthermore, (C) the curing accelerator contains an adduct (a) of a phosphine compound represented by general formula (I) with a quinone compound and an adduct (b) of the phosphine compound represented by general formula (II) (wherein, Rs are each selected from substituted or unsubstituted 1-12C hydrocarbon groups and substituted or unsubstituted 1-12C alkoxy groups and all may each be the same or different; and n denotes an integer of 0-3, except that all are 0 for three phenyl groups) in (80/20) to (40/60) weight ratio (a)/(b) of the (a) to the (b). COPYRIGHT: (C)2005,JPO&NCIPI
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