发明名称 Electronic circuit connecting structure, and its connecting method
摘要 A connecting structure comprises a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land, wherein the first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.
申请公布号 US2004231878(A1) 申请公布日期 2004.11.25
申请号 US20040844695 申请日期 2004.05.13
申请人 HIGASHIDA TAKAAKI;YAMAMOTO KENICHI;SUETSUGU DAISUKE;NAGAOKA MIYUKI;IMANAKA TAKASHI;NITTA TOSHINARI 发明人 HIGASHIDA TAKAAKI;YAMAMOTO KENICHI;SUETSUGU DAISUKE;NAGAOKA MIYUKI;IMANAKA TAKASHI;NITTA TOSHINARI
分类号 H05K1/14;H01L21/60;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H01L23/02 主分类号 H05K1/14
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