| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a contact mechanism to a wafer in which a semiconductor is suitably aged at a stage of a wafer. <P>SOLUTION: A plurality of free-standing mutual contact elements 710 such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements are mounted to relatively small tile substrates 702 which are then mounted and connected to a relatively large electronic component substrate 706, thereby stationing a plurality of contact elements to an electronic component. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-stage aging and the like. Further, solder balls, a z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates 702 and the electronic component. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
