| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily perform a cleavage in a manufacturing process in which a compound semiconductor wafer is chipped. SOLUTION: A wafer cleaning device comprises a scribing mechanism 50 for scribing the wafer W; a wafer retention mechanism 20 that has a placement surface for placing the wafer W and retains the wafer W while one end projects outside the placement surface; a stress application mechanism 60 coming into contact with the projection site of the wafer W for pressing to apply bending stress; and flexible sheet materials 27 and 69 interposed between the placement surface and the wafer W, and between the stress application mechanism 60 and the wafer W, respectively. COPYRIGHT: (C)2005,JPO&NCIPI |
