发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To realize easily stable performance and high yield of semiconductor integrated circuit which mounts insulated gate transistors of a high voltage system and a low voltage system. SOLUTION: In the semiconductor integrated circuit device, low voltage system insulated gate version transistors C, D, and high voltage system insulated gate version transistors A, B of a high voltage system are mounted on a semiconductor substrate 1. A second conductive semiconductor layer 21 is formed on the first conductive semiconductor substrate 1. A first conductive semiconductor layer 23 is formed on the second conductive semiconductor layer 21. A second conductive padding diffusion layer 22 is formed in a part over the second conductive semiconductor layer 21 and the first conductive semiconductor layer 23 in a region where at least a first conductive high voltage system insulated gate version transistor B is formed. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004335670(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030128514 |
申请日期 |
2003.05.07 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YAMAOKA TORU;MORINAGA MINORU |
分类号 |
H01L21/761;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;(IPC1-7):H01L21/823;H01L21/823 |
主分类号 |
H01L21/761 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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