发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize easily stable performance and high yield of semiconductor integrated circuit which mounts insulated gate transistors of a high voltage system and a low voltage system. SOLUTION: In the semiconductor integrated circuit device, low voltage system insulated gate version transistors C, D, and high voltage system insulated gate version transistors A, B of a high voltage system are mounted on a semiconductor substrate 1. A second conductive semiconductor layer 21 is formed on the first conductive semiconductor substrate 1. A first conductive semiconductor layer 23 is formed on the second conductive semiconductor layer 21. A second conductive padding diffusion layer 22 is formed in a part over the second conductive semiconductor layer 21 and the first conductive semiconductor layer 23 in a region where at least a first conductive high voltage system insulated gate version transistor B is formed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335670(A) 申请公布日期 2004.11.25
申请号 JP20030128514 申请日期 2003.05.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAOKA TORU;MORINAGA MINORU
分类号 H01L21/761;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;(IPC1-7):H01L21/823;H01L21/823 主分类号 H01L21/761
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