发明名称 |
Integrated circuit inductor with integrated vias |
摘要 |
Integrated circuit inductors (5) are formed by interconnecting various metal layers (10) in an integrated circuit with continuous vias (200). Using continuous vias (200) improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor (5).
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申请公布号 |
US2004232556(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20040843952 |
申请日期 |
2004.05.11 |
申请人 |
PITTS ROBERT L.;BALDWIN GREG C. |
发明人 |
PITTS ROBERT L.;BALDWIN GREG C. |
分类号 |
H01L21/822;H01F17/00;H01L21/02;H01L23/522;H01L27/04;H01L27/08;(IPC1-7):H01L27/108 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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