发明名称 Integrated circuit inductor with integrated vias
摘要 Integrated circuit inductors (5) are formed by interconnecting various metal layers (10) in an integrated circuit with continuous vias (200). Using continuous vias (200) improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor (5).
申请公布号 US2004232556(A1) 申请公布日期 2004.11.25
申请号 US20040843952 申请日期 2004.05.11
申请人 PITTS ROBERT L.;BALDWIN GREG C. 发明人 PITTS ROBERT L.;BALDWIN GREG C.
分类号 H01L21/822;H01F17/00;H01L21/02;H01L23/522;H01L27/04;H01L27/08;(IPC1-7):H01L27/108 主分类号 H01L21/822
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