发明名称 |
System and method for increasing bump pad height |
摘要 |
In accordance with the present invention, a system and method for increasing bump pad height in a flip chip assembly are provided. The method includes depositing a bump pad on a substrate and depositing a solder mask on the substrate to define an opening surrounding the bump pad. A resist material is then deposited on the substrate such that the resist material covers the bump pad and solder mask. The resist material is then etched to form a column-shaped opening above the bump pad, and a conductive material is deposited into the column-shaped opening. The remaining resist material may then be optionally removed, leaving behind a column of conductive material above the bump pad. |
申请公布号 |
US2004232562(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20030445164 |
申请日期 |
2003.05.23 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HORTALEZA EDGARDO RULLODA;CALDERON COSUE GLENN ENRICK;ARQUISAL RODEL BELARMINO |
分类号 |
H01L21/48;H01L21/56;H01L23/498;H05K1/11;H05K3/24;H05K3/28;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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