| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an electric semiconductor device improved in a dielectric strength and electric characteristics. <P>SOLUTION: The electric power semiconductor device is obtained by sealing an electric power semiconductor chip 3 mounted on a substrate 1, by a sealing resin 4 through a coating material film 6. In this case, the sealing resin 4 is a phenol curing type epoxy resin composition, and the coating material film 6 is formed of polyimide having phenol group, while the phenol group of the coating material reacts chemically and simultaneously with the phenol curing type epoxy resin, during forming the sealing, and is connected chemically with the epoxy resin whereby adhesiveness with the epoxy resin becomes firm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
