INSULATION/BINDING TREATMENT SOLUTION AND INSULATION/BINDING TREATMENT METHOD OF ELECTRIC APPARATUS COMPONENT USING THIS TREATMENT SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide a new insulation/binding treatment solution and its treatment technology replacing a conductor treatment technology of the electric apparatus components by conventional varnish treatment. SOLUTION: The treatment solution is a mixture of an organic silicone compound and/or a hydrolysis/dehydration condensate of the organic silicone compound with a solvent comprising water and/or an organic solvent, the content of the the organic silicone compound and/or the hydrolysis/dehydration condensate of the organic silicone compound is specified to a range of 10-40 mass% as a solid content in terms of SiO2. As the organic silicone compound, one or more compounds represented by formula (1). (R1)nSi(X)4-n(1). Here, n is an integer of 0-20; R1is 1-6C hydrocarbon group or phenyl group; X is an alkoxy group represented by (OR2); R2is 1-6C alkyl group; and when R1and R2are plural, they may be different. COPYRIGHT: (C)2005,JPO&NCIPI