| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease a working hour loss for a mounting auxiliary operation. <P>SOLUTION: A packaging device comprises a substrate moving mechanism 5 for holding and moving a substrate P along a predetermined direction, a plurality of component supplying device 6 for individually supplying an electronic component to be mounted on the substrate, two mounting heads 7L, 7R for holding and mounting the supplied electronic component on the substrate P, an X-axis moving meachanism 8 for individually moving each mounting head 7L, 7R, and a Y-axis moving mechanism 9 for moving them to a direction orthogonal to the X-axis moving mechanism 8. An operation controlling means 150 making one of the mounting head 7R (7L) to mount the electronic component when making one of the mounting head 7L (7R) to do the mounting auxiliary operation is provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
