发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining device which are capable of realizing the machining with high accuracy. <P>SOLUTION: The machining is executed by the irradiation of a laser beam in a prescribed area of a workpiece 6 laid on a moving stage 7. Positional information of a machining start point and a machining end point is set to a comparator 15 by a stage controller 14 before the movement of the stage 7. A displacement amount of the stage 7 during moving is detected by an encoder 12 and it is transmitted to the comparator 15. The comparator 15 judges whether the stage reaches the preset machining start point or the preset machining end point or not from the displacement amount of the stage 7. When the stage reaches there, the comparator 15 transmits a signal for controlling the opening/closing of an external shutter 3 and executes the switching control of the irradiation/non-irradiation of the laser beam to the workpiece 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004330221(A) 申请公布日期 2004.11.25
申请号 JP20030126568 申请日期 2003.05.01
申请人 HOYA CANDEO OPTRONICS CORP 发明人 OISHI ATSUSHI
分类号 G02B26/02;B23K26/00;B23K26/08;(IPC1-7):B23K26/08 主分类号 G02B26/02
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