| 摘要 |
PROBLEM TO BE SOLVED: To provide the connection structure of a multilayer printed wiring board suitable for high density packaging. SOLUTION: An FPC 2 has an exposed conductor part 2A composed of a foil-like conductor 21 forming an external exposure surface, and an insulating substrate 22 arranged tightly to the surface of the conductor 21 opposite to the exposure surface. The FPC 2 has a multilayer structure where a reinforcing plate 23 is arranged tightly on the substrate 22 at the exposed conductor part 2A. A multilayer printed wiring board 1 is formed, in the board thickness surface thereof, with an opening 10B for inserting the exposed conductor part 2A of the FPC 2. The insertion opening 10B is provided with a plurality of through terminals 11A at positions where the conductors 21 of the FPC 2 are coupled when the FPC 2 is inserted. The conductors 21 of the FPC 2 are connected electrically when they are soldered to the through terminals 11A. COPYRIGHT: (C)2005,JPO&NCIPI |
