发明名称 |
CONNECTION STRUCTURE OF ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of an electronic component in which even a plurality of electronic components (FETs) can be mounted while being spaced apart from a printed wiring board, and the fact that the electronic components are touching a metal case surely can be confirmed. SOLUTION: A lower case 11 composed of a member having a high thermal conductivity and being fixed with an electronic component (FET) 12 has a substantially U-shaped front view and a printed wiring board 13 is supported across the top parts thereof. The surface fixed with the electronic component 12 has a shape visible from the outside and the printed wiring board 13 is supported at a specified interval so that the body of the electronic component 12 does not abut against the printed wiring board 13. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004335895(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030132239 |
申请日期 |
2003.05.09 |
申请人 |
YAZAKI CORP |
发明人 |
SUZUKI KATSUYA;SAKATA HIROAKI |
分类号 |
H05K7/20;H05K7/14;(IPC1-7):H05K7/14 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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