发明名称 CONNECTION STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of an electronic component in which even a plurality of electronic components (FETs) can be mounted while being spaced apart from a printed wiring board, and the fact that the electronic components are touching a metal case surely can be confirmed. SOLUTION: A lower case 11 composed of a member having a high thermal conductivity and being fixed with an electronic component (FET) 12 has a substantially U-shaped front view and a printed wiring board 13 is supported across the top parts thereof. The surface fixed with the electronic component 12 has a shape visible from the outside and the printed wiring board 13 is supported at a specified interval so that the body of the electronic component 12 does not abut against the printed wiring board 13. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335895(A) 申请公布日期 2004.11.25
申请号 JP20030132239 申请日期 2003.05.09
申请人 YAZAKI CORP 发明人 SUZUKI KATSUYA;SAKATA HIROAKI
分类号 H05K7/20;H05K7/14;(IPC1-7):H05K7/14 主分类号 H05K7/20
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