| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for achieving electrical connection in a dense and inexpensive way between the electrode patterns of a pair of printed circuit boards having densely packaged connection terminals, and to provide a circuit board device having printed circuit boards connected by this method. SOLUTION: The circuit board device comprises a first board 101 with a connection terminal 103 formed thereon and a second board 102 with a connection terminal 104 corresponding to the connection terminal 103 formed thereon. In the same plane where the connection terminal 104 of the second board 102 exists, positioning chip members 105a and 105b approximately cubic in shape are accurately positioned on previously formed connection pads, and are then surface-mounted in a reflow soldering process. The first board 101 and the second board 102 are so positioned that their connection terminals 103 and 104 face each other. The first board 101 is fitted into between the positioning chip members surface-mounted on the board 102 for the establishment of electrical connection between their connection terminals 103 and 104. COPYRIGHT: (C)2005,JPO&NCIPI
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