发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing corrosion of a fuse and having high reliability, and a manufacturing method thereof. SOLUTION: A first NSG film (first insulating film) 31 by a high density plasma CVD method and a second NSG film (second insulating film) 32 by a plasma CVD method are laminated on an uppermost wiring layer 20 functioning as a fuse to form a first protective film 30, and then the surface of the protective film 30 is flattened by a CMP method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335612(A) 申请公布日期 2004.11.25
申请号 JP20030127316 申请日期 2003.05.02
申请人 SEIKO EPSON CORP 发明人 KAMIYA TOSHIYUKI
分类号 H01L23/52;H01L21/3205;H01L21/82;(IPC1-7):H01L21/82;H01L21/320 主分类号 H01L23/52
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