| 摘要 |
The invention provides a slim type packaging structure with high heat dissipation, which is to provide a hole on the surface of a substrate, and then a die is placed inside the hole. Besides, a plurality of wire is separately connected from the die to the substrate. Alternatively, a heat-dissipating panel with good conductivity can be placed inside the hole, and then the die is placed on the heat-dissipating panel. Thus, after the substrate is soldered on the circuit board, a direct heat-dissipating path can be formed between the die and the circuit board; therefore, the die can dissipate heat without passing through the substrate. Hence, the slim type packaging structure with high heat dissipation provided by the invention can achieve double effects of good heat dissipation and package volume slimming as well as have the advantages of low cost and simple design.
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