发明名称 |
Semiconductor wafer protective device and semiconductor wafer treatment method |
摘要 |
A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.
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申请公布号 |
US2004235269(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20030468452 |
申请日期 |
2003.08.20 |
申请人 |
KITAMURA MASAHIKO;NANJO MASATOSHI |
发明人 |
KITAMURA MASAHIKO;NANJO MASATOSHI |
分类号 |
H01L21/683;B24B7/22;H01L21/00;H01L21/02;H01L21/301;H01L21/68;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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