| 摘要 |
An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate. The method comprises (a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing the covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent capable of reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state. In a preferred embodiment, metallization is accomplished by inducing precipitation of metal, e.g. copper, on the surface to be metallized (this effect also being referred to as "plate-out"), via decomposition of the electroless solution. The inventive process contrasts with the prior art, wherein electroless copper deposition is predominantly initiated or triggered through a Pc-bearing layer. Preferably, the non-precious metal ions used in step (a) are copper or nickel ions, whereas the plated metal is copper. The non-metallic substrate is made of insulating materials, for example organic polymers, silicon-containing materials, glass-epoxy composites and the like. The reducing agent is selected from a group consisting of borane compounds, e.g. dimethylamino borane (DMAB) and alkali metal or alkaline earth metal borohydrides.
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