| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for grinding a flake workpiece for attaining thinning, surface smoothing and high flattening by solving problems in a lapping-polishing method and a wafer rotating integrated grinding wheel machining method. SOLUTION: A grinding wheel 2 rotated in a reverse direction to the rotation of the disk-like workpiece w is lowered to the machined surface center part of the rotated workpiece w so that the outer end abuts on it. The outer end of the grinding wheel is moved from there to the outer peripheral part of the workpiece, tracing the machined surface and separated from the workpiece at the outer peripheral part. As the outer end of the grinding wheel moves from the center part of the workpiece to the outer peripheral part, the rotating speed of the grinding wheel is reduced, and the sum of the circumferential speed of the outer end of the grinding wheel and the circumferential speed of the workpiece in an optional machining position from the center part to the outer peripheral part of the workpiece is made constant. COPYRIGHT: (C)2005,JPO&NCIPI
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