发明名称 |
SCREEN PRINT UNDER-BUMP METALIZATION (UBM) TO PRODUCE LOW COST FLIP CHIP SUBSTRATE |
摘要 |
A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an elevated temperature to form an under-bump metalization layer of an interconnect pad. The elevated temperature is below a melting temperature of the terminal metalization pad. |
申请公布号 |
WO2004102622(A2) |
申请公布日期 |
2004.11.25 |
申请号 |
WO2004US14147 |
申请日期 |
2004.05.07 |
申请人 |
FLIPCHIP INTERNATIONAL, L.L.C.;LIN, PAUL, T. |
发明人 |
LIN, PAUL, T. |
分类号 |
H01L;H01L21/60 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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