Flüssigkristallvorrichtung, deren Herstellungsverfahren und elektronisches Gerät

摘要

Described is liquid crystal device enabling a decrease in an area for mounting a liquid crystal driving IC thereon, and having high reliability, and a method of manufacturing the liquid crystal device. A driving IC (1) is face-down bonded to a substrate (2). The thickness (T) of the driving IC (1) is made larger than the thickness (t) of a opposing substrate (3) of a liquid crystal panel (50), and the upper surface (61) of the driving IC (1) is made higher than the upper surface (63) of the opposing substrate (3). The upper surface (61) of the driving IC (1) is heated and pressed by a bonding tool (4) to bond bumps (21) of the driving IC (1) to interconnecting lines (41) and (42), and bond the driving IC (1) to the substrate (2) with an adhesive (7). It is thus possible to sufficiently heat and press the driving IC (1) without contact between the bonding tool (4) and the opposing substrate (3), thereby permitting bonding with high reliability.