发明名称 PREDICTION SYSTEM AND PREDICTION METHOD FOR PLASMA TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To improve the prediction accuracy by selecting the data usable for prediction based on the result of a multivariate analysis. <P>SOLUTION: Operating data and treatment result data such as upper electrode thickness obtained for each wafer treatment are collected in an operating data memory 202 and in a treatment result data memory 204. Data usable for prediction are selected based on the result of a multivariate analysis conducted for the collected operating data by an analysis section 208, and the correlation between the selected operating data and treatment result data is determined. Based on the determined correlation, and by using the operating data for the treatment of wafers other that on which the correlation has been obtained, the state of the plasma treatment apparatus or that of the object of treatment are predicted as the results of treatment. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335841(A) 申请公布日期 2004.11.25
申请号 JP20030131463 申请日期 2003.05.09
申请人 TOKYO ELECTRON LTD 发明人 YAMAZAKI YOSHIHIRO
分类号 H05H1/00;B01J19/08;G05B13/02;H01L21/3065 主分类号 H05H1/00
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