| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board having no uneven surface of a micro circuit and an excellent electric characteristic by which the drilling property and productivity of IVH as a problem caused by thinning a copper foil can be satisfied at the same time. SOLUTION: The method for manufacturing a printed wiring board includes a step where a copper foil formed as a power supply layer on an insulation resin composite layer is plated to make a conductor circuit. In this case, a metallic layer that can be peeled off is formed on a surface not being in contact with the insulation resin composite layer of the copper foil, and after a laser is applied onto the metallic layer to drill it, the metallic layer is peeled off. COPYRIGHT: (C)2005,JPO&NCIPI |
