| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion apparatus in which the amount of warpage of a photoelectric element can be reduced, while using a thermosetting resin as an adhesive, and to provide a photoelectric conversion apparatus. <P>SOLUTION: An area of a portion where a thermosetting die bond resin 12 is applied is made smaller than an area of a portion where a light-receiving element 11 is mounted. With this constitution, an effect of reducing the amount of warpage of a light-receiving element surface can be obtained, even if the light-receiving element 11, thermosetting die bond resin 12 and package 10 which are the same as those in a conventional technique are used. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
