发明名称 |
FILM PATTERN FORMING METHOD, DEVICE, DEVICE MANUFACTURING METHOD, ELECTROOPTICAL DEVICE AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film pattern forming method capable of forming film patterns having various shapes with a high treatment capacity. SOLUTION: This film pattern forming method has a process for forming a bank B on a board P and a process for allowing liquid droplets of a functional liquid L to impinge against the board P to arrange the functional liquid L on a demarcated region A demarcated by the bank B and satisfies the following conditions, that is, (a) the surface of the board P in the demarcated region A is lower than that of the bank B in the contact angle with the functional liquid L and (b) at least a part of the liquid droplets comes into contact with the board P in the demarcated region A at the time of impingement of the liquid droplets. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004330165(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030133282 |
申请日期 |
2003.05.12 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HIRAI TOSHIMITSU |
分类号 |
G02F1/1343;B05D1/26;G02F1/1368;H01L21/027;(IPC1-7):B05D1/26;G02F1/136;G02F1/134 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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