发明名称 FILM PATTERN FORMING METHOD, DEVICE, DEVICE MANUFACTURING METHOD, ELECTROOPTICAL DEVICE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a film pattern forming method capable of forming film patterns having various shapes with a high treatment capacity. SOLUTION: This film pattern forming method has a process for forming a bank B on a board P and a process for allowing liquid droplets of a functional liquid L to impinge against the board P to arrange the functional liquid L on a demarcated region A demarcated by the bank B and satisfies the following conditions, that is, (a) the surface of the board P in the demarcated region A is lower than that of the bank B in the contact angle with the functional liquid L and (b) at least a part of the liquid droplets comes into contact with the board P in the demarcated region A at the time of impingement of the liquid droplets. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004330165(A) 申请公布日期 2004.11.25
申请号 JP20030133282 申请日期 2003.05.12
申请人 SEIKO EPSON CORP 发明人 HIRAI TOSHIMITSU
分类号 G02F1/1343;B05D1/26;G02F1/1368;H01L21/027;(IPC1-7):B05D1/26;G02F1/136;G02F1/134 主分类号 G02F1/1343
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