| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which is carried out in high efficiency, without leakage of electric current in plating process, when a fine bump is formed on an insulating layer opened by a laser etc. in the substrate composed of a conductive layer and insulating layer. SOLUTION: The method for manufacturing a printed wiring board includes a process where a via hole is formed so that an insulating layer is opened through, a conductive is exposed in the board containing the conductive layer and insulating layer, and a desmear treatment of the bottom of the via hole is carried out. The desmear treatment is carried out so as to protect the exposed surface other than the via hole bottom of the conductive layer by a detachable covering material having a resistance to a desmear liquid. COPYRIGHT: (C)2005,JPO&NCIPI
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