PLATING METHOD, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To suppress sticking between parts to be plated and variation in a plating film in a plating method using a vibration plating device. SOLUTION: Plating is performed in such a manner that a flowing state where the contents of a container 30 flow mainly to the horizontal direction with a vibration transmission part 40 as the center and another flowing state where the contents flow mainly to the vertical direction are alternately repeated by periodically changing the frequency of the vibration generated in a vibration generating part 10. COPYRIGHT: (C)2005,JPO&NCIPI