GAPFILL PROCESS USING A COMBINATION OF SPIN-ON-GLASS DEPOSITION AND CHEMICAL VAPOR DEPOSITION TECHNIQUES
摘要
A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.
申请公布号
WO2004101840(A1)
申请公布日期
2004.11.25
申请号
WO2004US02850
申请日期
2004.01.30
申请人
APPLIED MATERIALS INC.;CUI, ZHENJIANG;ROBERTS, RICK, J.;COX, MICHAEL, S.;ZHAO, JUN
发明人
CUI, ZHENJIANG;ROBERTS, RICK, J.;COX, MICHAEL, S.;ZHAO, JUN