| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which is ready for an increase in the number of external terminals (use of multiple pins) to be allocatable to a mounting surface. SOLUTION: Processes for manufacturing a semiconductor device comprising: the first laminate forming process which forms the first laminate by mounting the first wiring portions 35 on a semiconductor chip 15, wherein the respective first wiring portions 35 has each respective second conductive part 26 which is electrically connected with the first electrode pad 14a on the semiconductor chip 15 and protruding to the main plane 15a of the semiconductor chip; a process for forming an insulating layer as the top side layer on the loading plane of a tentative substrate, and further for taking a first surface reforming process which reduces adhesion of a sealing layer 40 to the surface of an insulating layer; the second laminate forming process which forms the second laminate by forming a wiring layer which is extended from the loading region to the non-loading region of the semiconductor chip and contacted with the first wiring portions; a bonding process for connecting the second conductive portions and the wiring layer; the third laminate forming process which forms the third laminate comprising the first laminate and the second laminate by covering the first laminate and the wiring layer with a sealing layer; and a peeling off process for peeling off the tentative substrate from the third laminate. COPYRIGHT: (C)2005,JPO&NCIPI
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