| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of grinding a resin substrate by which an electrode can be exposed efficiently without producing a rough portion on the resin or burrs on the electrode at the time of exposing the electrode by grinding the resin substrate, such as the CSP substrate etc., in which the electrode is formed. SOLUTION: In this method of grinding the resin substrate 13, the resin substrate 13 is ground by using a grinding device provided with at least a rotatable chuck table 27 and a grinding wheel 30 constituted by annularly fixing a plurality of pipe-like grindstone chips 32 to a wheel base 31. The resin substrate 13 is ground by holding the substrate 13 on the chuck table 27 and bringing the grindstone chips 32 into contact with the substrate 13 by rotating the chuck table 27 and, at the same time, the grinding wheel 30. Since the grindstone chips 32 are formed in the pipe-like shapes, the contact areas of the chips 32 with the resin are small and the clogging caused by the resin, metals, etc., hardly occurs. COPYRIGHT: (C)2005,JPO&NCIPI
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