| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount resin-made low profile hollow package the thickness of a package bottom face of which is made thin up to a thickness of leads or a thickness close to that of the leads without deteriorating the moisture proofness. SOLUTION: The resin-made hollow package is a resin-made hollow package wherein a semiconductor element is mounted in its hollow part and the semiconductor element is air-tightly sealed by a lid member. In the leads made of a conductive metallic plate for realizing electric continuity, the upper surface of the inner lead is exposed to the hollow bottom face, the lower surface and the end of the outer lead are respectively exposed to the bottom face and an outer face lower end of the hollow package, and a lead intermediate part is embedded into the resin. Further, a moisture proof plate whose upper side has an insulating layer and whose width is equal to or wider than the width of the hollow part bottom side is located to the middle of the bottom of the hollow package, the moisture proof plate is fixed to the lower side of the inner lead via the insulating layer, and the lower side of the moisture proof plate is exposed to the bottom side of the hollow package. COPYRIGHT: (C)2005,JPO&NCIPI
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