| 摘要 |
PROBLEM TO BE SOLVED: To prevent migration from moisture in dust and atmosphere by performing connection and resin sealing continuously thereby shortening the leaving time before the sealing process and reducing the process. SOLUTION: In the method for packaging a radiation imaging device, a thermocompression head 301 and a sealing resin dripping head 401 are moved while being interlocked integrally. The lead wire 2011 of one of two adjacent TCPs 201 and the connection wire 1011 of a PCB 101 are connected electrically by thermocompression using solder or ACF. Following to the connection, the lead wire 2011 of the other of two adjacent TCPs 201 and the connection wire 1011 of the PCB 101 are connected electrically by thermocompression using solder or ACF. At the same time, the connection terminal of one TCP 201 thermocompressed previously and the PCB 101 is sealed by dripping sealing resin. Subsequently, electrical connection and resin sealing are performed continuously for the connection terminals of two adjacent TCPs 201 and the PCB 101. COPYRIGHT: (C)2005,JPO&NCIPI
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