发明名称 THERMALLY CONDUCTIVE EPOXY RESIN MOLDED PRODUCT AND PREPARATION METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive epoxy resin molded product which is excellent in thermal conductivity, and a preparation method therefor. <P>SOLUTION: The thermally conductive epoxy resin molded product essentially comprises an epoxy resin having an azomethine group and has a thermal conductivity of 0.5-30 W/(m×K). In the epoxy resin, a molecular chain to which the azomethine group is bound is oriented in a fixed direction, and the thermal conductivity in the orientation direction is preferably 0.5-30 W/(m×K). The thermally conductive epoxy resin molded product is prepared by applying a magnetic field to the epoxy resin in a fixed direction and subsequently curing the epoxy resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004331811(A) 申请公布日期 2004.11.25
申请号 JP20030129400 申请日期 2003.05.07
申请人 POLYMATECH CO LTD 发明人 HIDA MASAYUKI;KIMURA TORU;ISHIGAKI TSUKASA;SHIMOYAMA NAOYUKI;AOKI HISASHI;OCHI KOICHI;HARADA MIYUKI
分类号 B29C37/00;B29K63/00;C08G59/02;C08G59/28;C08G59/50;C08L63/00;(IPC1-7):C08G59/02 主分类号 B29C37/00
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