| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method for preventing the occurrence of a defect such as a scratch on a workpiece by positively and uniformly controlling atmosphere humidity to a requested value. <P>SOLUTION: This workpiece polishing device is provided with a polishing plate, an abrasive fluid supply means, a workpiece holding means and a humidity control means. The abrasive fluid supply means supplies an abrasive fluid onto the rotated polishing plate, and the workpiece holding means brings the held workpiece into pressure contact with the polishing plate to polish the workpiece. The humidity control means controls atmosphere humidity on the polishing plate to 55% or more by producing mist by an ultrasonic oscillator. In the workpiece polishing method, the polishing plate is rotated, and the abrasive fluid is supplied onto the polishing plate. While controlling the atmosphere humidity on the polishing plate to 55% or more by the humidity control means for producing mist by the ultrasonic oscillator while measuring humidity by a hygrometer, the workpiece is brought into pressure contact with the polishing plate to polish the workpiece. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
