PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To adjust the arranging position of resin between semiconductor packages easily without causing any deterioration in the arrangement precision of the semiconductor packages.

SOLUTION: Before semiconductor packages PK1 and PK2 are connected electrically through bump electrodes 13, resin 15 is placed on a semiconductor chip 3 such that at least a part of the semiconductor chip 3 is exposed, and then the semiconductor packages PK1 and PK2 are connected electrically through bump electrodes 13 while sustaining the resin 15 arranged on the semiconductor chip 3 in the state of stage A or stage B.

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