发明名称 |
FORMING METHOD AND FORMING APPARATUS OF FILM PATTERN, CONDUCTIVE FILM WIRE, ELECTROOPTIC APPARATUS, ELECTRONIC APPARATUS, AND CONTACTLESS CARD MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a film pattern whereby radiation noise is reduced. SOLUTION: The film pattern forming method jets out liquid drops of liquid containing a film forming component to a prescribed film forming region on a substrate to form a film pattern, and jets out liquid drops 103 of small diameters so as to bury recesses (dents) 102 of a wire 101 formed by the continuous drawing of liquid drops (standard drops) 100 with prescribed particle diameters so as to configure the smooth wire. Thus, parts with acute angles having conventionally been formed to edges for forming the wire 101 can be avoided, the wire width is uniformized and the generation of high frequency noise can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004335849(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030131598 |
申请日期 |
2003.05.09 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KOYAMA MINORU;YAMAZAKI YASUNORI |
分类号 |
B41J2/01;G09F9/00;H01L21/288;H01L21/3205;H05B33/10;(IPC1-7):H01L21/288;H01L21/320 |
主分类号 |
B41J2/01 |
代理机构 |
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