| 摘要 |
PROBLEM TO BE SOLVED: To obtain a single wafer processing two-fluid washing station which has a two-fluid jet nozzle for cleaning a semiconductor wafer and can obtain sufficient removal performance of contaminants. SOLUTION: The two-fluid jet nozzle 1 is used wherein dry air or gas of nitrogen and fluid like pure water are mixed and make mist, and minute waterdrops are sprayed on a wafer surface with a high speed. A wafer 2 is held by a holding part so as to face the two-fluid jet nozzle 1 and rotated. During the rotation of the wafer 2, a plurality of scanning operations are performed from the center of the wafer 2 to the outer peripheral direction by the two-fluid jet nozzle 1. Two fluid is injected at low speed rather than the time of the first scan at the time of scan of the second henceforth. Contamination on the wafer 2 is removed and cleaning is performed. COPYRIGHT: (C)2005,JPO&NCIPI
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