LAND PATTERN FOR SURFACE MOUNT OF FOOTPRINT ELECTRODE CHIP COMPONENTS, FRONT SIDE MOUNTED METHOD, BUFFER SUBSTRATE, AND ELECTRONIC OMPONENTS

摘要

PROBLEM TO BE SOLVED: To prevent tilting of a chip component in the case of solder packaging of a footprint electrode chip component of a light receiving element or the like on a substrate side, and further maintain highly efficient property of the chip components. SOLUTION: A land pattern 40 for surface mount is formed in top view of a buffer substrate 30 to which a footprint electrode 11 of the footprint electrode chip component 10 is joined with soldering. The land pattern 40 is constituted of lands 41 which are plurally divided and arranged in the longitudinal direction of the footprint electrode 11. After the footprint electrode 11 of the footprint electrode chip component 10 is soldered to the land pattern 40 for surface mount, a terminal electrode 31 of the buffer substrate 30 is soldered to a substrate. COPYRIGHT: (C)2005,JPO&NCIPI