发明名称 METAL PLATING METHOD FOR HARDLY CONDUCTIVE BODY
摘要 PROBLEM TO BE SOLVED: To provide a metal plating method for a hardly conductive body where metal plating having excellent adhesion is performed to the surface of the object to be plated consisting of a hardly conductive body such as plastic and ceramic. SOLUTION: The surface of the object 12 to be plated consisting of a hardly conductive body is coated with a thermosetting coating material, and, before a coating film 13 consisting of the thermosetting coating material is set, metal plating is applied to the surface of the coating film 13, and further, while pressurizing treatment is performed from the outside, heating treatment for the perfect setting of the thermosetting coating material is performed. Thus, the metal plating having extremely excellent adhesion can be applied to the surface of the hardly conductive body such as plastic and ceramic via the thermosetting coating material. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004332023(A) 申请公布日期 2004.11.25
申请号 JP20030127224 申请日期 2003.05.02
申请人 ISHIKAWA KINZOKU KOGYO KK 发明人 TSURU YUTAKA;OYAGI YASHICHI
分类号 B05D7/24;C23C18/16;C23C18/18;C25D5/56;(IPC1-7):C23C18/18 主分类号 B05D7/24
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