发明名称 Solid-state imaging apparatus and manufacturing method thereof
摘要 The present invention aims to provide a solid-state apparatus and a manufacturing method thereof, the solid-state apparatus having both high transfer efficiency in a horizontal transfer CCD and efficient breakdown voltage in a vertical transfer CCD and including a semiconductor substrate 110, first layer poly-silicon electrodes 120 and second layer poly-silicon electrodes 130 which form two layered overlap poly-silicon electrodes, an embedded channel region 140 which is formed in a surface unit of the semiconductor substrate 110 and becomes a transfer path for signal charge, and a photodiode region where photodiodes are aligned two-dimensionally, the photodiodes converting light into signal charge and accumulating the signal charge, wherein an inter-electrode distance c in the horizontal transfer CCD is shorter than an inter-electrode distance a in the vertical transfer CCD.
申请公布号 US2004233314(A1) 申请公布日期 2004.11.25
申请号 US20040847442 申请日期 2004.05.18
申请人 KURIYAMA TOSHIHIRO 发明人 KURIYAMA TOSHIHIRO
分类号 H01L21/339;H01L27/14;H01L27/148;H04N5/335;H04N5/341;H04N5/369;H04N5/372;H04N5/376;(IPC1-7):H04N5/335 主分类号 H01L21/339
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