发明名称 VISUAL INSPECTION METHOD, SEMICONDUCTOR CHIP VISUAL INSPECTION METHOD, AND WAFER VISUAL INSPECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a visual inspection method for inspecting pass/fail precisely, a semiconductor chip visual inspection method, and a wafer visual inspection method. <P>SOLUTION: An inspection area is set to one image file to be inspected, and the pass/fail of the inspection area is determined by reading pass/fail criteria data predetermined to the image file. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004333144(A) 申请公布日期 2004.11.25
申请号 JP20030125060 申请日期 2003.04.30
申请人 TOSHIBA CORP 发明人 TOKUYAMA KENICHI
分类号 G01N21/956;G06T1/00;H01L21/66 主分类号 G01N21/956
代理机构 代理人
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