| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a method for forming a blind via-hole and/or a through-hole with an excellent hole shape and a small diameter by directly emitting a laser onto a copper clad plate. <P>SOLUTION: A metal foil to at least one side of which a resin composition layer is adhered is used, hot-molten or laminate-adhered to the copper clad plate at room temperature, and thereafter the laser is directly emitted thereon to form a hole. In the case that copper foil burrs take place in the hole, an auxiliary sheet is exfoliated after formation of the hole, the copper foil burrs are dissolved and removed by using a chemical and the copper foil is also dissolved and removed in its thickness direction to attain a thickness of 1 to 5μm, and the circuit is formed by a conventional method or the semiadditive method thereafter. Since the blind via-hole and/or a through-hole with an excellent hole shape and a small size can be formed and no contamination is caused on the surface of the copper foil, a highly dense printed wiring board can be manufactured without causing a defect such as a short-circuit and a broken pattern in the circuit formation of copper foil thin lines. Further, the processing speed is considerably faster than that with the case of making a hole by drilling, the productivity is excellent and excellent economy is attained. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
