| 发明名称 |
HOLE FORMING METHOD, PRINTED WIRING BOARD, AND HOLE FORMING DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hole forming method for drilling a substantially straight hole on a board, a printed wiring board having a hole formed by this method, and a hole forming device for forming the hole. <P>SOLUTION: The printed wiring board 10 is irradiated with a laser 24 from its front surface to form a halfway hole 18a, and the board 10 is irradiated with the laser 24 from its rear surface to form a penetrated hole 18. Since the hole 18 is formed by irradiating the board 10 with the laser 24 from its both surfaces, the substantially straight hole 18 can be formed, and a plating liquid can smoothly flow inside the hole 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2004335655(A) |
申请公布日期 |
2004.11.25 |
| 申请号 |
JP20030128155 |
申请日期 |
2003.05.06 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
YASUDA MASAHARU;YAMANAKA KIMIHIRO;TSUKADA YUTAKA |
| 分类号 |
B23K26/00;B23K26/38;B23K101/42;H05K1/02;H05K3/00;H05K3/42;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/00 |
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