| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein if a probe is brought into contact with an electrode pad to perform measurement for characteristic evaluation of a wafer, a protrusion due to a probe mark is generated and the protrusion collides with a counter electrode when the wafer and a glass substrate are stuck to each other. SOLUTION: In the state where the silicon wafer 31 wherein a circuit part is formed and the glass substrate 41 on which the counter substrate 42 is formed and which has through holes 43 in the positions corresponding to electrode pads 34 on the silicon wafer 31, are stuck to each other so that the electrode pads 34 and the through holes 43 are respectively opposed to each other, the measurement for characteristic evaluation of respective chips on the silicon wafer 31 is performed by bringing the probe into electric contact with respective electrode pads 34 on the silicon wafer 31 through the respective through-holes 43 in the transparent insulating substrate 41. COPYRIGHT: (C)2005,JPO&NCIPI |
