| 摘要 |
PROBLEM TO BE SOLVED: To attain the improvement of productivity in an electronic component by suppressing the reduction of a plating rate even when a Zn component is contained in a ceramic element assembly. SOLUTION: Plating treatment is performed by using an electroless Ni plating liquid obtained by adding phosphoric acid or phosphate to the conventional electroless Ni plating liquid containing an Ni source, a reducing agent, a complexing agent or the like, so that the electronic component such as a ceramic multilayer substrate or the like is produced. COPYRIGHT: (C)2005,JPO&NCIPI |
